Tin: Difference between revisions
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'''Tin''' is a [[Chemical elements|chemical element]], having the [[chemical symbol]] Sn. Its [[atomic number]] (the number of [[proton]]s) is 50. It has a [[Atomic mass#Standard atomic weights of the elements|standard atomic weight]] of | '''Tin''' is a [[Chemical elements|chemical element]], having the [[chemical symbol]] Sn. Its [[atomic number]] (the number of [[proton]]s) is 50. It has a [[Atomic mass#Standard atomic weights of the elements|standard atomic weight]] of [[Tin/Atomic mass|{{:Tin/Atomic mass}}]] and is a [[solid]] in its elemental form. | ||
Tin is considered to be a member of the "Post-transition metal" class of elements. At a [[pressure]] of 101.325 k[[Pascal (unit)|Pa]], it has a [[boiling point]] of 2,602 °[[Celsius (unit)|C]] and a [[melting point]] of 231.93 °C. | Tin is considered to be a member of the "Post-transition metal" class of elements. At a [[pressure]] of 101.325 k[[Pascal (unit)|Pa]], it has a [[boiling point]] of 2,602 °[[Celsius (unit)|C]] and a [[melting point]] of 231.93 °C. | ||
Tin is used heavily in many industries, providing (among other uses) a plating which is cost effective in preventing [[rust]] formation on [[iron]] and [[steel]], and as a major component in almost all varieties of [[solder]]. It is also used commonly as a [[catalyst]] for [[silicone]] [[mold making]]. | |||
''Pure'' Tin however, has been shown<ref>https://nepp.nasa.gov/whisker/background/</ref> to "grow whiskers" sometimes referred to as "[[Tin pest]]" Because of this, pure Tin must be used with caution around electronics and electrical circuits, especially in safety related applications. An alloy of Tin and Lead<ref>https://nepp.nasa.gov/whisker/photos/pom/2004april.htm</ref>, or Tin and Bismuth are sometimes used<ref>http://www.reliableplating.com/tin.html</ref> to help prevent whisker growth. | |||
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Revision as of 19:16, 22 August 2011
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Tin is a chemical element, having the chemical symbol Sn. Its atomic number (the number of protons) is 50. It has a standard atomic weight of 118.710(7)g/mol and is a solid in its elemental form.
Tin is considered to be a member of the "Post-transition metal" class of elements. At a pressure of 101.325 kPa, it has a boiling point of 2,602 °C and a melting point of 231.93 °C.
Tin is used heavily in many industries, providing (among other uses) a plating which is cost effective in preventing rust formation on iron and steel, and as a major component in almost all varieties of solder. It is also used commonly as a catalyst for silicone mold making.
Pure Tin however, has been shown[1] to "grow whiskers" sometimes referred to as "Tin pest" Because of this, pure Tin must be used with caution around electronics and electrical circuits, especially in safety related applications. An alloy of Tin and Lead[2], or Tin and Bismuth are sometimes used[3] to help prevent whisker growth.